A technical paper titled “Detection of defective chips from nanostructures with a high-aspect ratio using hyperspectral ...

The semiconductor industry is rapidly evolving, and as we look towards 2025, chiplets are at the forefront of this transformation. The shift from traditional monolithic system-on-chip (SoC) designs to ...

While the long-term future of mobile connectivity is bright, there are still short-term challenges to face.

Network-on-chip (NoC) soft tiling is complimentary but distinct from chiplets described above as it repeats modular units inside a NoC design. Soft tiling within a NoC offers scalability and ...

Any optimization problem must have a clear, unambiguous specification and a way to define the goodness of the solution. Today ...

Third party chiplets are hitting the market as chiplet models evolve. Who's calling the shots isn't clear yet.

ChatGPT and other LLMs have attracted most of the attention in recent years, but other forms of AI have long been ...

With an industry as large as semiconductors, there are often surprises lurking in some of the more specialized product ...

Progress is being made in generative EDA, but the lack of training data remains the biggest problem. Some areas are finding ways around this. Generative AI, driven by large language models (LLMs), ...

A new technical paper titled “The backpropagation algorithm implemented on spiking neuromorphic hardware” was published by ...

Addressing challenges of using silicon IP, tracking IP cores, and taking advantage of the flexibility of modular design requires a proven process. It also requires a state-of-the-art IP management ...

The team used a 3D printing technique called direct ink writing (DIW), an extrusion process in which a paste with controlled ...