Reflexion ® LK CMP - Applied Materials
WEBThe platform continues to use the integrated post-CMP Desica ® cleaner, which employs unique, full-immersion Marangoni ™ vapor drying technology to virtually eliminate watermark defects and dramatically reduce particle contamination.
Post-CMP Marangoni drying eliminates defects - News - Silicon …
WEBVapour drying technology is emerging for post-CMP cleaning applications in order to dry copper/low-k interconnect layers and to reduce yield-killing defects on 90nm and 65nm devices. A post-CMP cleaning process with integrated vapour drying eliminates water marks and reduces overall defects on copper/low-k patterned wafers, overcoming the ...
WEBApplied Materials, Inc. (Nasdaq:AMAT), the leading supplier of chemical mechanical polishing (CMP) systems to the semiconductor industry, announces that it has obtained an exclusive patent license from SCP Global Technologies to integrate single-wafer vapor drying technology on its Applied Reflexion(R) LK CMP system.
Post-CMP Cleaning - ScienceDirect
WEBJan 1, 2015 · Post-CMP cleaning is a critical step after CMP as it achieves effective removal of particulate and other contaminants for improvement of device yield in IC fabrication.
Chemical mechanical cleaning for CMP defect reduction
WEBMar 14, 2019 · This paper reviews the innovation of Applied Materials CMP in post-CMP cleaning, from Megasonic cleaning for improving particle removal efficiency, to single wafer IPA vapor dryer for achieving water-mark free drying, and to a unique chemical mechanical cleaning (PreClean) technology for fulfilling the requirement of organic residue, particle ...
Experimental Investigation of High-Performance Wafer
WEBSep 19, 2019 · Marangoni drying is a highly concerned technology in the integrated circuit (IC) manufacturing, which removes the deionization (DI) water on the wafer surface in the wet cleaning process after chemical mechanical polishing (CMP).
Advanced Wet Cleanings Post-CMP: Application to Reclaim Wafers
WEBDec 9, 2003 · Used after a chemical mechanical polishing (CMP) step, they significantly reduce the amounts of particles and metallic contaminants. Our study addresses polished reclaimed wafers.
Post-CMP Marangoni drying eliminates defects - ResearchGate
WEBApr 1, 2004 · It is found that applied material's new desica vapor-dry module is designed to eliminate SRD-related water marks on low-k metal interconnect patterned wafers.
WEBMarangoni drying is a highly concerned technology in the integrated circuit (IC) manufacturing, which removes the deionization (DI) water on the wafer surface in the wet cleaning process after chemical mechanical polishing (CMP).
Holistic Approach to Clean Process Optimization for High Throughput CMP ...
WEBFig 5a. CMP Vapor Dryer recipe parameters. Fig 5b. Normalized defect performance for the high TPT OptaTM and the standard TPT LKPrimeTM - "Holistic Approach to Clean Process Optimization for High Throughput CMP Applications".
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